iPhone 6S Rumors: Release Date, Thicker Dimension, Fewer Chips for Power Efficiency
Rumors have emerged around the upcoming iPhone 6S, including a release date, and leaked schematics showing a wider dimension, and fewer motherboard chips.
Alleged leaked images showing the iPhone 6S to be thicker than the iPhone 6, and featuring fewer motherboard chips have emerged online, with a rumored September release date for Apple's next flagship phone.
The leaked schematics feature the iPhone 6S as slightly thicker compared to its predecessor's 6.9mm width, supposedly due to a larger battery, or the incorporation of Force Touch technology previously seen on the Apple Watch.
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According to Phone Arena, the 0.2mm difference can be attributed to a higher 12MP camera resolution believed to add to the device's girth.
New 6S images have also emerged showing the flagship's updated NFC hardware and fewer chips to increase the phone's power efficiency. Close-up images show the phone's logic board with one section pared down to a minimal 3 chips compared to its predecessor's 10.
9to5 Mac theorizes cutting the number of chips has been reported to increase power efficiency as a result of the reduction of power-hungry components, leaving only the necessary ones in place, including the CPU, flash memory, a Cirrus Logic audio chip, a Murata Wi-Fi module and RFMD wireless power amplifiers.
An alleged launch date has also been disclosed, with Chinese tech website micgadget.com reporting Foxconn insiders have confirmed a Sept. 11 unveiling, and an official release date a week later.
Micgadget has also revealed a Taiwanese manufacturer has began mass production of the iPhone 6S in time for its unveiling and subsequent Sept. 18 release.
Last week, leaked images featuring the new iPhone's metal build appeared online, showing a similar appearance to its predecessor, with some changes in the device's optics, and a new dual camera at its rear.
